快速退火炉设备运行监测数据集

该数据集记录RTP设备运行中的关键参数（温度、时间、热量消耗等）、设备状态日志及工艺结果。通过时序分析，可追溯工艺偏差根源，保障半导体制造稳定性，主要包含了Start Time开始时间、End Time结束时间、LotID批次、Recipe ID配方编号、Heat Budget热预算、WaferID晶圆、WaferID晶圆、Ending结束、Log_Path日志路径、MaxTemp最高温度、ShiftTemp工艺段温度。This dataset records key operating parameters (including temperature, time, heat consumption, etc.), equipment status logs and process results during the operation of RTP equipment. Through time-series analysis, the root causes of process deviations can be traced to ensure the stability of semiconductor manufacturing. The dataset mainly includes the following fields: Start Time, End Time, LotID, Recipe ID, Heat Budget, WaferID, WaferID, Ending, Log_Path, MaxTemp, and ShiftTemp. Their respective explanations are as follows: Start Time refers to the process start time; End Time refers to the process end time; LotID refers to the batch number; Recipe ID refers to the recipe number; Heat Budget refers to the heat budget; WaferID refers to the wafer ID; Ending refers to the process ending status; Log_Path refers to the log storage path; MaxTemp refers to the maximum temperature; ShiftTemp refers to the process segment temperature.

搜集汇总

背景与挑战

背景概述

该数据集记录了半导体快速退火炉（RTP）设备运行的关键参数，包括开始时间、结束时间、配方编号、热预算、最高温度和工艺段温度等，以Excel格式存储。它主要用于设备运行效率评估、生产配方优化和故障诊断，帮助设备维护人员、生产管理人员和工艺工程师通过时序分析追溯工艺偏差，提高生产效率和产品质量，保障半导体制造过程的稳定性。