晶圆照片和良率测试数据集

本数据集主要为国家重点研发计划超高品质因子光子集成芯片（2021YFB2801200）有关晶圆生产工艺优化和晶圆生产测试结果的数据。 本数据集基于重庆联合微电子有限公司工艺加工的氮化硅晶圆。晶圆生产工艺优化和晶圆生产测试记录晶圆表面粗糙度测量，CMP工艺优化结果和良率测试结果。结果显示本批次的氮化硅芯片生产良率较好，说明了其量产的能力。数据量约420KB。This dataset primarily contains data related to wafer production process optimization and wafer production test results for the ultra-high quality factor photonic integrated chips project under the National Key R&D Program of China (2021YFB2801200). This dataset is based on silicon nitride wafers processed by Chongqing United Microelectronics Co., Ltd. The records of wafer production process optimization and production tests include wafer surface roughness measurements, Chemical Mechanical Polishing (CMP) process optimization results, and yield test results. The results show that the yield of this batch of silicon nitride chips is good, demonstrating their mass production capability. The total data volume is approximately 420 KB.

搜集汇总

背景与挑战

背景概述

该数据集源自国家重点研发计划项目，聚焦于氮化硅晶圆的生产工艺优化与良率测试，包含表面粗糙度测量、CMP工艺优化及测试结果等数据。结果表明，本批次芯片生产良率较高，验证了其量产潜力，数据以图片、文档等格式呈现。