光伏硅片精密线切割工艺参数与质量关联数据集

数据来源于公司的光伏硅片生产线，覆盖HCT-B5XD、MeyerBurger-450和NSS-1200三种主流切割设备，包含不同种硅锭型号的加工数据。数据通过工业物联网系统采集，包括设备PLC实时参数、在线质量检测数据、工艺工程师记录的异常事件与处理措施；同时整合了实验室检测的硅片微观形貌与表面粗糙度数据。数据留存在公司内部系统中，另外，留有记录的硅片精密线切割生产记录表作为纸质数据证明，所有的数据经过一系列的加工处理之后，形成数据集。The dataset is sourced from the company's photovoltaic silicon wafer production lines, covering three mainstream cutting equipment models: HCT-B5XD, MeyerBurger-450, and NSS-1200, and includes processing data for various silicon ingot models. The data is collected via Industrial Internet of Things (IIoT) systems, including real-time parameters of on-site PLCs, online quality inspection data, and abnormal events and their corresponding treatment measures recorded by process engineers. Additionally, it integrates silicon wafer microtopography and surface roughness data tested in the laboratory. The original raw data is stored in the company's internal systems, and paper records of precision wire-cut silicon wafer production are retained as documentary proof. All collected data are processed through a series of standardized workflows to form the final dataset.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于光伏硅片精密线切割工艺，包含60条记录，每年更新，涵盖了切割线速度、进给速度、线张力等关键工艺参数，以及硅片厚度、弯曲度、表面粗糙度等质量指标。它旨在通过分析参数与质量之间的关联，帮助企业优化切割过程、提升产品合格率，并为设备智能化和行业标准制定提供数据支持。