Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
收藏NIAID Data Ecosystem2026-03-10 收录
官方服务：
资源简介：
Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.
创建时间：
2018-12-26
