Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Name: Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
Published: 2024-01-23T09:17:09+08:00

Mendeley Data2024-06-25 更新2024-06-26 收录

电子封装材料

材料性能评估

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https://data.mendeley.com/datasets/d7xvd77rfp 数据链接链接失效反馈

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资源简介：

Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.

创建时间：

2024-01-23

Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

资源简介：

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