光学非球面超精密切削的在位测量及补偿加工

开发一种采用接触式测头与电容式位移传感器相结合的在位测量装置及非球面测量与补偿加工软件，进行 C3604 黄铜球面及非球面的单点金刚石超精密切削加工，并开展在位测量及补偿加工试验。补偿加工后，经在位测量系统测量，球面面形精度 PV 达到 231.4 nm，非球面面形精度 PV 达到 206.3 nm；与TaylorhobsonPGI1840比对，结果分别相差 3.0 nm 和 7.0 nm，验证了在位测量系统测量的精确性和补偿加工的有效性。数据量为1.53MB。

A combined in-situ measuring device integrating a touch probe and a capacitive displacement sensor, as well as aspheric measurement and compensation machining software, was developed. Single-point diamond ultra-precision cutting machining was conducted on spherical and aspheric surfaces of C3604 brass, followed by in-situ measurement and compensation machining experiments. After compensation machining, measured by the in-situ measurement system, the PV value of spherical surface shape accuracy reached 231.4 nm, while that of aspheric surface shape accuracy reached 206.3 nm. Compared with the Taylorhobson PGI1840, the respective differences were 3.0 nm and 7.0 nm, which verified the measurement accuracy of the in-situ measurement system and the effectiveness of the compensation machining. The total data volume is 1.53 MB.

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背景概述

该数据集聚焦于光学非球面超精密切削的在位测量与补偿加工技术，通过开发接触式测头与电容式位移传感器结合的在位测量装置及配套软件，对C3604黄铜球面及非球面进行单点金刚石超精密切削加工。补偿加工后，经在位测量系统验证，球面和非球面面形精度PV分别达到231.4 nm和206.3 nm，与标准设备比对误差较小，证实了测量系统的精确性和补偿加工的有效性。