晶片切割应用数据集

面向激光晶片材料与器件的重大战略需求； 使用复合式影像测量仪测量样品切割加工后的切割截面厚度。主要包括硅衬底、蓝宝石衬底，碳化硅衬底。 晶片切割应用数据集包含三个目录，第一个目录为蓝宝石衬底厚度测试数据，第二个目录为碳化硅衬底厚度测试数据，第三个目录为硅衬底厚度测试数据。 文件包含三个目录，每个目录都有表格型数据，数据中包含宏观切割前图片，宏观切割扩膜后图片，显微效果图片，侧面图片 数据量大小6.54MBTo address the critical strategic requirements for laser wafer materials and devices, this dataset measures the dicing cross-section thickness of post-processed samples using a composite image measuring instrument. The main sample substrates include silicon, sapphire, and silicon carbide. This wafer dicing application dataset consists of three directories: the first holds thickness test data for sapphire substrates, the second for silicon carbide substrates, and the third for silicon substrates. Each directory includes tabular data, alongside four categories of images: macroscopic pre-dicing images, macroscopic images after film expansion post-dicing, microscopic images, and side-view images. The total data size is 6.54 MB.

搜集汇总

背景与挑战

背景概述

该数据集旨在满足激光晶片材料与器件的战略需求，通过复合式影像测量仪采集硅、蓝宝石和碳化硅衬底在切割后的截面厚度数据。数据包含图片和表格形式，总大小约为6.54MB，涵盖三种衬底类型的测试结果。