Replication Data for: Effect of Cu^2+ on deposition mechanism and structure of ZrO2-based conversion coatings on AA6060 aluminium alloys and their susceptibility to filiform corrosion

Zirconium oxide-based conversion coatings (CCs) were prepared from hexafluorozirconic acid, H2ZrF6, with and without Cu(II) as an additive. The CCs were prepared on primary and recycled AA6060. The deposition mechanism, structure, electrochemical properties and effectiveness in protection against filiform corrosion (FFC) have been explored. In presence of Cu(II) additives, a two step deposition mechanism is observed, evidenced by open circuit potential (OCP) measurements and in situ dynamic electrochemical impedance spectroscopy (dEIS). Copper deposits predominantly as copper(II) hydroxyfluoride on the top surface, and metallic Cu at the metal/CC interface, as evidenced by x-ray photoelectron spectroscopy (XPS) and glow-discharge optical emission spectroscopy (GD-OES). The presence of a Cu(II) additive induces a different distribution of the Zr oxide-based products. After deposition of a weak organic model coating, aluminium pretreated with the Cu(II)-containing system shows a 10-30% lower maximum filament length compared to the Cu(II)-free system in FFC tests, despite a ca. one order of magnitude higher cathodic activity of the former. The dataset contains raw data for reproducing the electrochemical measurements results and surface composition and structure. The data relative to the electrochemical characterization contain .txt files of open circuit potential and dynamic electrochemical impedance measurements. The data relative to the surface characterization contain .csv files for the GD-OES measurements, .vms file for the XPS measurement and .tif files for the scanning electron microscopy (SEM) pictures.以六氟锆酸（H₂ZrF₆）为基础原料，分别添加与不添加Cu(II)作为添加剂，制备了氧化锆基转化涂层（conversion coatings, CCs）。该类转化涂层分别在原生态与回收态AA6060铝合金表面制备得到。本研究对其沉积机理、微观结构、电化学性能以及抗丝状腐蚀（filiform corrosion, FFC）的防护效果开展了系统探究。当添加Cu(II)添加剂时，通过开路电位（open circuit potential, OCP）测试与原位动态电化学阻抗谱（dynamic electrochemical impedance spectroscopy, dEIS）表征，可观测到两步式沉积过程。经X射线光电子能谱（x-ray photoelectron spectroscopy, XPS）与辉光放电光发射光谱（glow-discharge optical emission spectroscopy, GD-OES）分析结果证实，铜主要以羟基氟化铜(II)形式沉积于涂层表层，以金属铜形式沉积于金属与转化涂层的界面处。Cu(II)添加剂的引入会改变氧化锆基产物的分布特征。在涂覆弱有机模型涂层后，经含Cu(II)预处理的铝合金在丝状腐蚀测试中，其最大丝状长度相较于无Cu(II)体系低10%~30%，尽管前者的阴极活性高出约一个数量级。本数据集包含可复现电化学测试结果、表面成分与结构表征的原始数据。其中，电化学表征相关数据包含开路电位与动态电化学阻抗测试的.txt格式文件；表面表征相关数据包含GD-OES测试的.csv格式文件、XPS测试的.vms格式文件，以及扫描电子显微镜（scanning electron microscopy, SEM）成像的.tif格式图像文件。