高性能铜箔微纳组织结构与性能关联关系及调控机理研究数据集

本数据集来源于研究电沉积工艺参数及新型添加剂对铜箔微纳组织结构及性能的影响中所产生的表征测试数据，具体包括：（1）电解工艺参数对电解铜箔微观结构及性能的影响数据集，包括：铜箔表面SEM表征，不同工艺参数对铜箔表面粗糙度Rz的影响，不同工艺参数及各组元添加剂下所制备铜箔的抗拉强度和延伸率力学性能；（2）新型离子液体添加剂对铜箔微观结构、表面形貌和力学性能的影响数据集，包括：表面形貌的SEM表征、铜箔截面晶粒取向的EBSD表征及晶粒尺寸与孪晶密度的定量统计、铜箔截面微观组织结构的TEM表征与分析、新型离子液体添加剂在铜箔表面的FT-IR吸附研究、不同添加剂浓度下所制备铜箔的抗拉强度和延伸率性能。This dataset is derived from characterization and test data generated in the study of the effects of electrodeposition process parameters and novel additives on the micro-nano structure and properties of copper foils. Specifically, it includes two parts: (1) Dataset for the effects of electrolytic process parameters on the microstructure and properties of electrolytic copper foils, covering: SEM characterization of copper foil surfaces, the effects of different process parameters on the surface roughness Rz of copper foils, and the mechanical properties (tensile strength and elongation) of copper foils prepared under different process parameters and with various additive components; (2) Dataset for the effects of novel ionic liquid additives on the microstructure, surface morphology and mechanical properties of copper foils, covering: SEM characterization of surface morphology, EBSD characterization of grain orientation in copper foil cross-sections and quantitative statistics of grain size and twin density, TEM characterization and analysis of the micro-nano structure of copper foil cross-sections, FT-IR adsorption study of novel ionic liquid additives on copper foil surfaces, and the tensile strength and elongation properties of copper foils prepared at different additive concentrations.

搜集汇总

背景与挑战

背景概述

该数据集聚焦高性能铜箔的微纳组织结构与性能之间的关联关系及调控机理研究。它包含了电解工艺参数对铜箔微观结构和性能的影响数据，以及新型离子液体添加剂对铜箔微观结构、表面形貌和力学性能的影响数据。数据具体涉及SEM、EBSD、TEM、FT-IR等表征测试结果，以及抗拉强度和延伸率等力学性能指标。