硅基多层三维光交叉芯片测试数据

课题指标阵列规模≥4×4×3，每层包含≥4×4光交叉连接阵列，任意层间可实现可重构光互连，交叉连接重构时间≤10ns，层内波导损耗≤1dB/cm，层内光交叉连接插损≤3dB，层间耦合结构尺寸≤10μm×10μm，层间耦合效率≥80%，层间三维光交叉连接插损≤4dB，层间波导串扰≤-50dB的数据处理。数据是在实验室环境下，使用可调谐激光器对硅基光波导进行光信号输入，对光功率计进行读数得到的，采用Origin对测试数据作图，得到报告中的相关实验结果图片。在window10及以上环境下，使用Origin软件打开相应文件程序，即可导出相应数据结果。

The dataset covers data processing with the following technical indicators: the array scale is ≥4×4×3, each layer contains ≥4×4 optical cross-connect (OXC) arrays, reconfigurable optical interconnections can be realized between any layers, the reconfiguration time of cross-connects is ≤10 ns, the intra-layer waveguide loss is ≤1 dB/cm, the intra-layer OXC insertion loss is ≤3 dB, the inter-layer coupling structure size is ≤10 μm×10 μm, the inter-layer coupling efficiency is ≥80%, the inter-layer 3D OXC insertion loss is ≤4 dB, and the inter-layer waveguide crosstalk is ≤-50 dB. The experimental data were obtained in a laboratory environment, where a tunable laser was used to input optical signals into the silicon-based waveguides, and an optical power meter was used for readings. The Origin software was employed to plot the test data, generating the relevant experimental result images included in the report. The corresponding data results can be exported by opening the relevant files with the Origin software under Windows 10 or later environments.

搜集汇总

背景与挑战

背景概述

该数据集提供了硅基多层三维光交叉芯片的测试数据，涵盖了阵列规模、层间耦合效率、插损等关键性能指标。数据通过实验室测试和Origin软件处理获得，包括实验结果图片和可导出的数据文件。