半导体封装领域发明专利价值分析数据

对半导体封装领域发明专利数据检索分析，有利于了解该项技术发展趋势及核心技术，避免企业重复研发或侵犯他人的知识产权。a+b+c+d+e+f+g=分数，其中：a.专利有效期得分，数据下载日至预估到期日年份数，每年得1分；b.发明人数量得分为发明人人数，每有1人得1分； c.代理机构情况得分，有为5分，没有为0分； d.被引用次数得分，每被引用1次+10分； e.同族专利数，每多一个其他同族专利+1分，以1个为基准； f.权利要求数，以10条权利要求为基准，每少1条-1分，每多1条+1分；g.转让次数，每被引用1次+5分。根据分数划分为无价值、一般价值、中等价值、高价值专利。Retrieval and analysis of invention patent data in the semiconductor packaging field can help understand the development trends and core technologies of this field, as well as assist enterprises in avoiding redundant R&D and intellectual property infringement. The total score is calculated as a+b+c+d+e+f+g, with specific scoring rules as follows: a. Patent validity score: 1 point is awarded for each year between the data download date and the estimated patent expiration date; b. Inventor count score: 1 point is granted per inventor; c. Agency score: 5 points if a patent agency is retained, otherwise 0 points; d. Citation count score: +10 points for each received citation; e. Family patent count score: +1 point for each additional patent family beyond the baseline of 1 patent family; f. Claim count score: Based on the baseline of 10 claims, 1 point will be deducted for each claim fewer than 10, and +1 point for each claim more than 10; g. Transfer count score: +5 points for each patent right transfer; Patents are classified into four value tiers: low-value, general-value, medium-value and high-value patents based on the total score.

搜集汇总

数据集介绍

特点

该数据集提供了半导体封装领域发明专利的价值分析，包含667条数据，每年更新。通过多个指标对专利进行评分，帮助了解技术发展趋势和避免知识产权侵权。