磁控溅射法制备Au薄膜及真空载流摩擦学行为研究

针对空间滑动电接触金基润滑涂层在制备方法以及失效机理认识方面存在的不足，探索采用绿色磁控溅射法制备金薄膜. 研究了偏压对薄膜微观结构、力学以及真空载流摩擦学性能的影响规律；建立了真空载流服役工况摩擦试验评价条件，可实现接触电流噪音的实时监测，进一步对比传统电镀金涂层，研究了其真空载流摩擦磨损行为差异、主要影响因素及作用机制. 结果表明：在适中的偏压下，薄膜晶粒尺寸小，结构致密光滑，具有高的结合力、硬度、耐磨性以及低的接触电流噪音. 相比于电镀法，磁控溅射法制备的金膜表现出明显光滑致密的结构特征，硬度、磨损率和接触电流噪音大幅改善. 其中光滑致密的结构是抑制微电弧产生的关键因素，可有效减少电弧侵蚀失效.Aiming at the gaps in the understanding of preparation methods and failure mechanisms of gold-based lubricating coatings for space sliding electrical contacts, this work explores the fabrication of gold thin films via green magnetron sputtering. The effect of substrate bias voltage on the microstructure, mechanical properties and vacuum current-carrying tribological performance of the films is systematically investigated. A friction test evaluation setup for vacuum current-carrying service conditions is established, which enables real-time monitoring of contact current noise. Furthermore, compared with traditional electroplated gold coatings, the differences in vacuum current-carrying friction and wear behavior, main influencing factors and their action mechanisms are studied. The results show that under moderate bias voltage, the gold thin films feature small grain size, dense and smooth structure, high adhesion strength, hardness, wear resistance, and low contact current noise. Compared with the electroplating process, the gold films prepared by magnetron sputtering exhibit significantly smoother and denser microstructures, with greatly improved hardness, wear rate and contact current noise. Notably, the smooth and dense microstructure is the key factor to suppress the generation of micro-arcs, which effectively reduces arc erosion failure.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于磁控溅射法制备Au薄膜，研究其在真空载流条件下的摩擦学行为，旨在解决空间滑动电接触涂层在制备和失效机理方面的不足。通过分析偏压对薄膜微观结构、力学性能和摩擦学性能的影响，并对比传统电镀法，发现磁控溅射法能产生更光滑致密的薄膜结构，显著提升硬度、耐磨性和降低接触电流噪音，从而抑制微电弧产生，减少失效。